Major projects promote IC "China creation"

IC design industry has presented two development dimensions: vertical and horizontal, while vertical development is to strive to improve the content of science and technology, and has made remarkable progress in catching up with the advanced international level. China's implementation of the “01” and “02” programs reflects the strategy for in-depth development, aiming to break the situation in China’s high-end integrated circuit manufacturing equipment and processes that rely heavily on imports, and promote the technological upgrading and structural adjustment of related industries, and for integrated circuits “China Create "lay the runway.

With the implementation of Special Project 02, China has made significant progress in the field of manufacturing processes and packaging technology, but it is still necessary to continue its support for the domestic IC industry's independent innovation.

First, policy preferences still need to continue. Although China's domestic packaging and testing companies have achieved remarkable results in the development and application of some advanced forms of packaging, the overall level of technology is still dominated by low-end and low-end packaging, and there is a large gap between the advanced international level. This requires a focus on policy concessions and should continue to provide key support to domestic key players. In addition, China's integrated circuit chip manufacturing technology has always lagged behind two international advanced technological nodes. To reduce the gap, huge capital investment is still needed, and policy support is essential.

The second is the availability of funds. The investment in semiconductor technology is huge. Therefore, supporting funds need to be borne by the three parties at the national, local, and corporate levels. National and local funds should be allocated in time to accelerate the development of scientific research and the industrialization of results. However, in the actual operation process, due to the funds allocated by the State Released too late, local matching funds have not been put in place, forming a funding gap, directly affecting the implementation of the project. For example, due to problems such as the lack of timely funding for SMIC, the number of customers introduced at 65nm and the introduction of products still appear to be low, and progress has been slow, affecting the breadth and depth of industrialization of results.

Third, the biggest appeal for any special project is still industrialization, so it is necessary to keep pace with the market's “beat”. However, in the domestic market, the market demand for advanced packaging technology products remains unstable. Foreign large companies have high technical requirements, strict control of yields, and difficulties in obtaining orders and continuing supply. The number of domestic orders is unstable and there are fluctuations. Therefore, we must also strengthen the cooperation between upstream and downstream companies in the industrial chain and jointly expand the market for advanced packaging technologies. In the manufacturing process, the foundry also needs to develop and introduce the corresponding IP. The chip design company must also increase its integration with the technology, and it can be firmly tied to the market in a tight bondage.

The fourth is to speed up the development of shortages of talents, especially high-end technology research and development, market development and corporate management personnel. Enterprises need such high-level talents in the development and industrialization of advanced technologies and packaging technologies. It is imperative to establish a ladder-type training system for talents. While actively introducing overseas professional high-end talents, the domestic institutes must also increase the training of high-level talents, and rely on the opportunity of special cooperation in production, education, and research to jointly cultivate talented people with enterprises.