Summary of the six-point reference data for PCB micro-section resin selection

1. Low peak temperature Too high peak temperature will cause copper oxidation and affect the observation effect of the slice under the microscope. When the powder and liquid are mixed, it will generate heat. If the temperature is too high, the viscosity will increase, which will affect the penetration of micropores.

2. The low shrinkage cold mounting material will shrink when solidified. At this time, there will be a gap between the inlay material and the sample. When the sample is polished, some abrasives (such as silicon carbide particles on sandpaper) may be embedded in this gap. In the next process, these abrasive particles will It is dragged out to produce a deep scratch on the surface of the sample, which affects the polishing effect.

3. Low-viscosity mixed resins have low viscosity and good fluidity, which helps the resin penetrate into the micropores and recessed areas.

4. Transparency The operator should see the exact position of the target area of ​​the sample through the inlay resin. Therefore, the resin is required to have good transparency.

Five, five bubbles, after mixing and solidifying the resin powder and liquid, no bubbles are required. Samples with bubbles are unqualified. The bubbles are black under the microscope, covering the area to be inspected.

6. Strength Resin has good strength to help demoulding, and it is not easy to crack during operation.