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The drafter of lead free solder national standards of GB/T20422-2006. Lead Free Solder Wire,Rosin Core Solder,Flux Core Solder,Low Temperature Solder Shaoxing Tianlong Tin Materials Co.,Ltd. , https://www.tianlongspray.com
Observed from the market side, as Elpida is still full of uncertainties after the market, even though the current DRAM market is still in an oversupply situation, PC-OEM plants are still gradually increasing their inventory levels, in response to the possibility of Elpida withdrawing from the market. The DRAM maker took a tougher stance and insisted on a gradual increase in prices, which was the main reason for the contract price increase in late March. In the spot market, unlike the contract market price, the price still keeps rising. Since Elpida filed for bankruptcy protection, the overall transaction volume is not very hot due to the uncertain demand momentum and weak buying momentum. The average price of DDR32Gb1333Mhz particles is also high. The main reason for the turmoil at around US$1 is that, except that Elpida’s supply in the spot market has not been significantly reduced, the spot market has only accounted for the overall DRAM market compared with the market share of 20-30% years ago. With 13% of the market, the decline in influence is also another reason.
Jibang Technology stated that the possibility of a sustained increase in the April contract price is still high, but it still depends on further decision making by Elpida, which is the third largest revenue market, and will affect the overall DRAM market price trend in the afternoon market. Faced with the era of Elpida, this time will be a great opportunity for industry consolidation.
Jibang Technology further stated that the fourth-quarter DRAM industry brand revenue market share of Korean manufacturers has accounted for nearly 70% of the global DRAM industry. Taiwan, the United States and Japan DRAM Factory can only divide up the remaining 30% of the market, in addition to the economic scale is difficult to The competition among Korean manufacturers, the slow progress of the process, and the improper product mix have continued to increase the amount of losses. In view of this, since the middle of last year, Taiwan-based DRAM plants have gradually withdrawn from standard DRAM production capacity. ProMOS has only 10K non-standard DRAM products in continuous production. Powerchip production has also been transformed into OEM business. Japanese manufacturers Bidatta also made a shocking bomb at the end of February this year and formally filed for bankruptcy protection with the Tokyo Metropolitan Government. The consolidation of the DRAM industry also seems to be a way to go.
Jibang Technology believes that from the DRAM industry competition situation analysis, Taiwan, the United States and Japan DRAM factory alliance should be the only way to survive with the Korean manufacturers to survive, such as Taiwan's DRAM plant has the film's economic scale and rapid mass production Capacity, if there is good technology transfer and support, Taiwan-based DRAM plants can shoulder heavy responsibility to reduce costs. The US-based manufacturers, in addition to a good relationship with the first-line PC-OEM, the server memory can maintain a good market share, coupled with the Flash products can be combined with mobile memory, will be able to smart phones and tablet computers Some gains. Japanese manufacturers, regardless of the standard memory and mobile memory, its yield and process into the Korean manufacturers are not inferior to, if you can transfer more capacity into Taiwanese manufacturers, and cooperate with the US manufacturers to manufacture multi-chip package Memory (MCP), attack smart mobile terminal market, then the cost control and profitability will be expected to increase. If Taiwan, the United States and Japan can successfully establish an alliance, the total production capacity will be able to come up and down 410K, accounting for 34% of global DRAM production capacity, will have the opportunity to become the new third force, DRAM industry will likely become the top three market structure. (Editor: Lecea)
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The drafter of soft solder test method national standards of GB/T28770-2012.
The drafter of lead free solder-chemical composition and type industry standards of SJ001-2007.
Recently, according to DRAMeXchange, a research division of TrendForce, the price of the contract continued to increase in early March. The average price of the DDR34GB memory module came to the price of 19 dollars, which was an increase of 2.7%, and the average price of 2GB was officially taken up. The price of 10 US dollars rose slightly by approximately 2.6%.