At present, the flip chip technology for mass production mainly has two routes: solder paste reflow technology and eutectic technology. For low-end and medium-to-low power, solder paste reflow technology is the mainstream, while for high-power devices, eutectic is the mainstream. In yesterday's article, the author made a preliminary analysis of the market potential of eutectic technology, and today it is mainly to explore the application of the market solder paste reflow technology. Previously, due to the complicated process of solder paste flip chip, the yield was low, and the price of flip chip was much higher than that of the formal dress. This also caused the flip-chip device to have a high voice, but it is difficult to form a scale promotion. Nowadays, this situation has been greatly improved. "Our foot 50W solder paste has been sold at a price of 4 yuan or less, and the price/performance ratio is outstanding." Wang Tianzhu, general manager of Yingshen Technology. "Currently, we have solder paste reflow or eutectic, solder paste is cost-effective for volume, and eutectic flip-chip has higher price and better stability, which is more suitable for high-power lighting." Manager Wang Mengyuan said that before the misunderstanding of the price of solder paste, the chip investment will be very large, so few customers willing to pay. However, despite the outstanding cost performance, due to the low melting point of the solder paste, it is easy to produce the problem of creeping, so the chip insulation layer is very demanding, which also leads to a complicated chip process for the solder paste reflow process. Previously, chip makers needed to invest in equipment, and the complexity of the process led to lower flip chip yields, so flip chip prices would be much higher than formal. "Our solution is to directly negotiate with the chip manufacturer to customize the chip production according to our solder paste flip-chip process requirements, so the chips we use are exclusive." Wang Xiaotian, technical director of Yingshen Technology, said that due to company demand Stable and relatively large, this also provides the company with a larger bargaining space, chip prices will not be much improved. For Zhonghao Optoelectronics, because the chip can do it by itself, it is more flexible. “When solder paste is flipped, special equipment is needed to ensure high yield. Secondly, solder paste flipping has a corresponding requirement for the electrode structure and reflection efficiency of the chip. If the chip does not meet the requirements, the solder paste is flipped. The yield and reliability of the device will be greatly reduced." Wang Mengyuan mentioned. According to the reporter's understanding, in order to control the cost, many Zhongshan enterprises use 0.5W or 0.8W solder paste to flip the COB device to impersonate 1W device, and increase the current to improve the light-emitting efficiency of the lamp (from 150MA to 300MA). This practice will cause the device to fail quickly, causing severe light decay, which will cause people to distrust the flip-chip device. Currently, formal devices account for more than 80% of the market. In Wang Mengyuan's view, the current technology is not fully mature, whether it is eutectic flip or solder paste, which is mainly reflected in low yield, low cost performance, low reliability, and low matching. To solve these problems, the scale application of flip-chip COB devices is possible.
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