MEMS sensors relied on imported high-end market cake is still very big

China is the world's largest electronics production base, but most high-end MEMS sensors rely on imports. This shows that the MEMS sensor in the high-end market is still a big cake, exactly how to divide this piece of cake, all look at the strength of various companies. In order to break this predicament, it is imperative to use the precise docking of R&D and application, the efficient collaboration of the industrial chain, and the generalization of the packaging standard as the three major players to integrate resources and key breakthroughs to promote the development of the industry to mid-to-high end.

MEMS sensors refer to new types of sensors manufactured using micromachining and semiconductor processes. Because of its advantages of small size, light weight, low power consumption, low cost, high reliability, ease of integration, and mass production, it gradually replaces the dominant position of traditional mechanical sensors and is widely used in consumer electronics, automobile manufacturing, and the Internet of things. Aerospace, pharmaceutical and chemical industries.

China is the world's largest production base for electronic products and consumes a quarter of the world's MEMS devices. However, due to the long-term MEMS sensor industry in the middle and lower reaches of the industrial chain, most high-end MEMS sensors rely on imports. In order to break this predicament, it is imperative to use the precise docking of R&D and application, the efficient collaboration of the industrial chain, and the generalization of the packaging standard as the three major players to integrate resources and key breakthroughs to promote the development of the industry to mid-to-high end.

Breaking out of R&D applications and speeding up the industrial chain to expand upstream. At present, China's MEMS manufacturers have a serious shortage of R&D innovation capabilities and motivation. R&D talent and resources are mainly concentrated in universities and research institutes. Research institutions have distorted demand for new MEMS devices and the needs of companies. Most scientific research results are difficult to implement. . To address this issue, domestic MEMS manufacturers should be encouraged to set up R&D incentive funds, gradually establish R&D design teams, establish long-term mechanisms for personnel exchange and joint training with research institutes, and promote research and development, process problems, and application of scientific research results. Open up channels for the exchange of scientific and technological achievements in scientific research institutes and encourage enterprises.

Strengthen the ability of industry collaboration and enhance the level of customization. In order to adapt to the diversified demands of consumer electronics, MEMS sensors are characterized by high levels of customization, fine process control, and strong material specificity, and have a higher demand for collaborative manufacturing capabilities in the upstream and downstream industries. This requires the mid-stream manufacturers to build and apply digital simulation and flexible manufacturing module platforms to guide the R&D and design, manufacturing, demand parties and other entities to participate in product customization, and to achieve flexible production of products with multiple varieties and small batches. At the same time, manufacturers should also work with the downstream packaging and testing suppliers to collaborate on the structure, characteristics and uses of MEMS devices, and collaboratively select or formulate a reasonable packaging process to improve product reliability and stability.

Speed ​​up the formulation of packaging standards to enhance the international competitiveness of the industry. At present, the consumption of MEMS sensors has grown rapidly. Demand has gradually concentrated on certain types of devices. MEMS packaging technology has become the key to success in the market. MEMS packaging technology has lower barriers, and fierce competition continues to squeeze market profit margins. This requires suppliers to develop standard packaging solutions in order to continue to reduce component size and production costs, and shorten time to market.

Domestic suppliers have a certain foundation in MEMS packaging. They should learn from and cite the experience and standards of microelectronic packaging. They can flexibly choose or fuse chip scale packaging and surface mount technology in the standard and develop suitable packaging standards for mainstream products in the market. At the same time, we will strengthen the international exchange of MEMS packaging standards, introduce China's mature packaging standards as international standards, and continuously improve our international influence.