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According to the upper, middle and lower reaches of the LED industry chain, the conference is divided into four special sessions, of which there are two special sessions in the middle. The meeting invited CTOs and executives from well-known enterprises in the LED industry chain to share the latest cutting-edge technologies in the industry and discuss the technological development trends of the upper, middle and lower reaches.
Wu Donghai, technical director of Tongfang Optoelectronics and Lighting Industry, analyzed the "how many different chips are in the future." 
Wu Donghai believes that for the chip, the manufacturing cost should not be further reduced, but also on this basis, the luminous efficiency of the chip should be continuously improved. "The injection of high current has become an inevitable trend, and the chip area has to be gradually reduced." Wu Donghai said that the new demand has also put forward new requirements for the chip. The injection of large current requires the chip to have low Vf and excellent IV performance. Also have a low Droop effect and good heat dissipation. With the development of the new Flip-Chip technology, the advantages of the Flip-Chip chip become more and more obvious. "The new Flip-Chip chip technology has good heat dissipation and is more suitable for high current injection. In high-power products. Has a clear advantage." 
On November 25th, the 2013 High-tech LED Conference-CTO held in conjunction with the 2013 Gaogong LED Lighting Exhibition was held in the D meeting room of Hall 5 of Guangzhou Poly World Trade Center. Dr. Xiao Guowei, Director and General Manager of Jingke Electronics, presided over the meeting. This meeting.